| Process | Description | Spec |
| Film | 1. Drawing film size | 30X26" |
| 2.Draw the minimum line width / space | 2/2mil |
| 3.Black and white, brown film the maximum size | Black film30x26" |
| 4.Computer-aided manufacturing data input format | 274X 274D |
| 5.Computer-aided manufacturing data output format | 274X 274D |
| Dry (Inner Layer) | 1.Minimum line width / spacing | 3mil |
| 2.Minimum pad size | Aperture+8 mil (0.2 mm) |
| 3.Tin ring vias | 3mil |
| 4.Non-isolated vias | 6mil |
| 5.The smallest to the largest thickness | 0.05~3.0mm |
| 6.The smallest to the largest board size | 310mm✽460mm |
| 7.Copper thickness | h~3oz |
| 8.(0.5/1/2oz)Etch Factor | 0.5oz~6oz |
| 9.Micro-erosion(Copper thickness loss) | 50u" |
| 10.Minimum Edge | 0.1mm |
| Dry (Outer Layer) | 1.Minimum line width / spacing | 3/3mil |
| 2.Minimum pad size | BGA 8mil |
| 3.The smallest to the largest thickness | 0.4~6.0mm |
| 4.The smallest to the largest board size | 0.3~3.5mm |
| 5.Tin ring vias | 4mil(tenting) |
| 6.Etch Factor | 0.3(YX) |
| Drill | 1.Minimum and maximum bit | 0.1~6.4mm |
| 2.Maximum board size | 660~625mm |
| 3.Hole tolerance | +/-2mil |
| 4.Finished plate diameter tolerance | +/-0.075mm |
| 5.Segmented diamond | yes(3 Segment) |
| 6.Hole wall roughness | 0.6mil |
| Lamination | 1.Minimum and maximum thickness | 0.2~6.0mm |
| 2.Minimum board size of work | 200x150mm |
| 3.Maximum board size | 700x640mm |
4.Between the inner plate and the copper film up to the
number of | 3Sheet |
| 5.After the film thickness of the lamination:+/-0.5mil/Sheet | +/-1mil |
| 6. Registration tolerance:+/-2mil | Yes |
| Plated | 1.Minimum to the maximum thickness | 0.4~6.0mm |
| 2.Aspect Ratio | 1:12 |
| 3.General thickness of 1.6mm hole copper thickness | 0.6mm |
| 4.Hole copper: | 1.4mil |
| 5.Copper surface | 2mil |
| 5.Copper tolerance) | +/-0.3mil |
| 6.Current Calculation | Length xWidth/929x1xASF(
Current density) |
| Solder Mask | 1.Thickness Minimum to the maximum thickness | 0.4~0.6mm |
| 2.Board Size | 700x640mm |
| 3.Substrate thickness on the solder minimum to maximum | 0.4~2mil |
| 4.Solder thickness of the copper surface of the smallest to the | 0.4~2mil |
| 5.Anti-tin solder pad size pad size than the line at | 3mil |
| 6.Tin solder between the minimum width of pad | 3mil |
| 7.QFP solder in between the minimum width | 3mil |
| 8.Plug hole size | 0.5mm |
| 9.Pre-treatment | Wash water mill, baking |
| Silk | 1.Minimum text size (smallest text symbol) | 5mil(Line Width)20~26mm(High ) |
| 2.The distance between text and tin pad | 5mil |
| Carbon ink | 1.Minimum to the maximum thickness | No |
| 2.Board Size | 400x500mm |
| 3.The thickness of the carbon ink | |
| 5.Tin-carbon ink pad (pad should be larger than the circuit tin) | 8mil |
| 6.Tin-carbon ink pad pitch | 31mil |
| 7.Spacing can be printed carbon ink | 15mil |
| HAL | 1.Minimum to the maximum thickness | 0.6~5.0mm |
| 2.The smallest to the largest board size | 160~595mm |
| 3.The smallest aperture (Wuxi plug) | 0.45mm |
| 4.The smallest to the largest tin thickness | 30~1000 |
| Goldfinger | 1.Minimum to the maximum thickness | 0.5~4.0mm |
| 2.The smallest to the largest board (board size limits work) | 150~610mm |
| 3.Minimum to the maximum thickness of nickel | 80~200mm |
| 4.Gold thickness of the smallest to the largest | 3u"~60u" |
| Forming | 1.Minimum to the maximum thickness | 0.2~6.0 |
| 2.Finished board size | 5x5mm |
| 3Dimension Tolerance | +/-0.1mm |
| 4.Best Tolerance Molding | 0.15mm |
| 5.Tolerance between the U-slot cheat | +/-0.05mm |
| V-Cut | 1.Minimum to the maximum thickness | 0.3~5.0mm |
| 2.Board Size Length X Width | Least 90x55mmMaximum(
Wide)550mmx(High)Limited |
| 3.Location accuracy and the residual tolerance | +/-0.05mm |
| 4.V-cut angle | 30 Degree 45 Degree |
| 5.V-shaped cutting knife dance | Minimum spacing3mm (30
Degree) |